Patents/Inventors

Jooyang Eom

Gimpo-siKR6 patents

6 Patents

US124179992025
Semiconductor Packages Using Package in Package Systems and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US123083642025
Power Module Package for Direct Cooling Multiple Power Modules
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US122306012025
High Power Module Package Structures
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US122059182025
Submodule Semiconductor Package
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US119844242024
Semiconductor Packages Using Package in Package Systems and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US118483202023
Power Module Package for Direct Cooling Multiple Power Modules
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites