22 Patents
- US126081572026Nonvolatile Memory Device, Controller for Controlling the Same, Storage Device Having the Same, and Method of Operating the Same
Samsung Electronics Co., Ltd.
0 cites - US125507242026Semiconductor Device and Massive Data Storage System Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US125384812026Semiconductor Device and Memory System Including Multiple Conductive Layers
Samsung Electronics Co., Ltd.
0 cites - US125388422026Three-dimensional Storage Device Using Wafer-to-wafer Bonding
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US124143012025Semiconductor Device and Data Storage System Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US124023062025Semiconductor Device Having Peripheral Circuit Areas at Both Sides of Substrate and Data Storage System Including the Same
Samsung Electronics Co., Ltd.
0 cites - US124023172025Semiconductor Devices and Data Storage Systems Including the Same
Samsung Electronics Co., Ltd.
0 cites - US123961742025Semiconductor Device and Data Storage System Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US123895962025Semiconductor Device and Data Storage System Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US123638992025Semiconductor Devices and Data Storage Systems Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites
- US122178002025Semiconductor Device and Data Storage System Including the Same
Samsung Electronics Co., Ltd.
0 cites - US121609922024Semiconductor Device and Electronic System Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US120574212024Nonvolatile Memory Devices and Data Storage Systems Including the Same
Samsung Electronics Co., Ltd.
0 cites - US120337062024Method of Operating Nonvolatile Memory Device, Nonvolatile Memory Device and Memory Controller Performing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites
- 0 cites
- US119355972024Semiconductor Device and Data Storage System Including the Same
Samsung Electronics Co., Ltd.
0 cites - US119013212024Three-dimensional (3D) Storage Device Using Wafer-to-wafer Bonding
Samsung Electronics Co., Ltd.
0 cites - 0 cites
- US117156842023Semiconductor Device and Massive Data Storage System Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US115813332023Integrated Circuit Device and Method of Fabricating the Same
Samsung Electronics Co., Ltd.
0 cites