18 Patents
- US126160752026Semiconductor Package Including a Semiconductor Chip on a Redistribution Substrate and Conductive Structure Spaced Apart from the Semiconductor Chip
SAMSUNG ELECTRONICS CO., Ltd.
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- US125503242026Three-dimensional Semiconductor Memory Device and Electronic System Including the Same
Samsung Electronics Co., Ltd.
0 cites - US124396032025Semiconductor Device Including Separate Upper Channel Structures and Electronic System Including the Same
Samsung Electronics Co., Ltd.
0 cites - 0 cites
- US122840662025Apparatus and Method for Effectively Mapping Reference Signal for V2X Communication in Wireless Communication System
SAMSUNG ELECTRONICS CO., Ltd.
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- US119686482024Apparatus and Method for Efficiently Transceiving PSFCH for V2X Communication in Wireless Communication System
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US118549122023Semiconductor Package Including a Chip Pad Having a Connection Portion and Test Portion in a First Surface of the Chip Pad
SAMSUNG ELECTRONICS CO., Ltd.
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- US116892622023Communication Device for Performing Beamforming and Operating Method Thereof
SAMSUNG ELECTRONICS CO., Ltd.
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- US115699572023Method and Apparatus for Transmitting and Receiving Downlink Control Channel in Shortened Transmission Time Intervals
SAMSUNG ELECTRONICS CO., Ltd.
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