4 Patents
- US126222752026Semiconductor Package Having Cooling Systems with Flow Control Devices Within Substrates
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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- US119675402024Integrated Circuit Direct Cooling Systems Having Substrates in Contact with a Cooling Medium
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites - US116159672023Power Module Package and Method of Manufacturing the Same
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites