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Inventors
Joongwon Shin
Suwon-si
KR
4 patents
4 Patents
US12607669
2026
Semiconductor Chip and Semiconductor Package Including the Same
Samsung Electronics Co., Ltd.
0 cites
US12550683
2026
Semiconductor Packages Having Test Pads
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US11616018
2023
Semiconductor Devices Including a Thick Metal Layer
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US11587897
2023
Semiconductor Device
SAMSUNG ELECTRONICS CO., Ltd.
0 cites