Patents/Inventors

Jongyoun Kim

Suwon-siKR24 patents

23 Patents

US124179722025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US123947532025
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US123006252025
Semiconductor Package Including Outer Conductive Plate
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122939892025
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US122438132025
Connection Structure and Method of Forming the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122305562025
Semiconductor Package and Method of Fabricating the Same
Samsung Electronics Co., Ltd.
0 cites
US122117772025
Semiconductor Package Including a Dummy Pattern
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122059142025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US121836902024
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120682702024
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120626212024
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US120574352024
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US119730282024
Redistribution Substrate, Method of Fabricating the Same, and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119488722024
Semiconductor Package and Method of Fabricating the Same
Samsung Electronics Co., Ltd.
0 cites
US119293162024
Semiconductor Package and Method of Fabricating the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119012762024
Semiconductor Package and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US118698352024
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US118375512023
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US118108492023
Connection Structure and Method of Forming the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116462602023
Semiconductor Package and Method of Fabricating the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116370812023
Semiconductor Package and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116005642023
Redistribution Substrate, Method of Fabricating the Same, and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115691572023
Semiconductor Package and Method of Manufacturing the Same
Samsung Electronics Co., Ltd.
0 cites