12 Patents
- US125507392026Semiconductor Package Including a Metal Plate and Package-on-package Having the Same
SAMSUNG ELECTRONICS CO., Ltd.
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- US124009702025Semiconductor Package Including Electromagnetic Shield Structure
Samsung Electronics Co., Ltd.
0 cites - US123082532025Molded Product for Semiconductor Strip and Method of Manufacturing Semiconductor Package
Samsung Electronics Co., Ltd.
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- US121430302024Restart of an Ac-to-dc Converter Upon a Temporary Drop-out of an AC Voltage
TEXAS INSTRUMENTS INCORPORATED
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- US120573572024Semiconductor Package Including Plurality of Recesses and Molding Member with Plurality of Protrusions That Fill the Recesses
SAMSUNG ELECTRONICS CO, Ltd.
0 cites - 0 cites