Patents/Inventors

Jongpa Hong

Suwon-siKR2 patents

3 Patents

US120741422024
Semiconductor Package and Method of Fabricating the Same
Samsung Electronics Co., Ltd.
0 cites
US118429822023
Semiconductor Package with Curing Layer Between Semiconductor Chips
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116769252023
Semiconductor Packages Having Improved Reliability in Bonds Between Connection Conductors and Pads and Methods of Manufacturing the Same
Samsung Electronics Co., Ltd.
0 cites