5 Patents
- 0 cites
- US122372582025Crosstalk Cancelation Structures Having Metal Layers Between Signal Lines Semiconductor Packages
Rambus Inc.
0 cites - US120876812024Packaged Integrated Device with Memory Buffer Integrated Circuit Die and Memory Devices on Module Substrate
Rambus Inc.
0 cites - 0 cites
- US117422772023Packaged Integrated Device Having Memory Buffer Integrated Circuit Asymmetrically Positioned on Substrate
Rambus Inc.
0 cites