Patents/Inventors

Jonghwan Baek

BucheonKR5 patents

5 Patents

US125937362026
Power Module Package with Stacked Direct Bonded Metal Substrates
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US123006892025
Dual Cool Power Module with Stress Buffer Layer
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US122117712025
Power Module and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US116581712023
Dual Cool Power Module with Stress Buffer Layer
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US116520302023
Power Module and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites