36 Patents
- 0 cites
- 0 cites
- 0 cites
- US124111962025Method for Reconstructing QSM MAP Using Dipole Compensation
SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
0 cites - 0 cites
- 0 cites
- 0 cites
- US122372402025Semiconductor Package and Method of Manufacturing Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites
- US121320192024Packaged Multi-chip Semiconductor Devices and Methods of Fabricating Same
Samsung Electronics Co., Ltd.
0 cites - 0 cites
- US121130502024Semiconductor Package with Increased Thermal Radiation Efficiency
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites
- 0 cites
- 0 cites
- US120402942024Semiconductor Devices and Semiconductor Packages Including the Same
Samsung Electronics Co., Ltd.
0 cites - 0 cites
- 0 cites
- 0 cites
- US119358732024Methods of Inspection of Semiconductor Packages Including Measurement of Alignment Accuracy Among Semiconductor Chips
Samsung Electronics Co., Ltd.
0 cites - US119277002024Systems, Methods, and Media for Improving Signal-to-noise Ratio in Single-photon Data
Wisconsin Alumni Research Foundation
0 cites - US118891382024Systems, Servers and Methods of Remotely Providing Media to a User Terminal and Managing Information Associated with the Media
Hanwha Techwin Co., Ltd.
0 cites - 0 cites
- US118626032024Semiconductor Packages with Chips Partially Embedded in Adhesive
Samsung Electronics Co., Ltd.
0 cites - 0 cites
- US117281422023Apparatus for Conducting Plasma Surface Treatment, Board Treatment System Having the Same
New Power Plasma CO., Ltd.
0 cites - US116949782023Semiconductor Devices and Semiconductor Packages Including the Same
Samsung Electronics Co., Ltd.
0 cites - 0 cites
- 0 cites
- 0 cites
- 0 cites
- 0 cites
- 0 cites
- US115691452023Semiconductor Package with Thermal Interface Material for Improving Package Reliability
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US115520332023Packaged Multi-chip Semiconductor Devices and Methods of Fabricating Same
Samsung Electronics Co., Ltd.
0 cites