Patents/Inventors

Jonghae Kim

San Diego, CAUS53 patents

45 Patents

US126209702026
Integrated Devices with Multiple Acoustic Resonator Chiplets
QUALCOMM INCORPORATED
0 cites
US125819562026
Through Molding Contact Enabled EMI Shielding
QUALCOMM INCORPORATED
0 cites
US125816922026
Transistor Devices with Double-side Contacts
QUALCOMM INCORPORATED
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US125433282026
Inductive Device Structure and Process Method
QUALCOMM Incorporated
0 cites
US125125932025
Antenna Module as a Radio-frequency (RF) Integrated Circuit (IC) Die with an Integrated Antenna Substrate, and Related Fabrication Methods
QUALCOMM INCORPORATED
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US124245182025
Capacitor Embedded 3D Resonator for Broadband Filter
QUALCOMM Incorporated
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US124009662025
Package Comprising Integrated Devices and Bridge Coupling Top Sides of Integrated Devices
QUALCOMM INCORPORATED
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US123951522025
Compact Hybrid Acoustic Wave Filter Structure
QUALCOMM INCORPORATED
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US123549482025
Integrated Device and Integrated Passive Device Comprising Magnetic Material
QUALCOMM INCORPORATED
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US123349032025
Substrate Comprising Acoustic Resonators Configured as at Least One Acoustic Filter
QUALCOMM Incorporated
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US123006552025
Integrated Circuit Assembly with Hybrid Bonding
QUALCOMM INCORPORATED
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US122836072025
3D Inductor Design Using Bundle Substrate Vias
QUALCOMM Incorporated
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US122730952025
Wideband Filter with Resonators and Inductors
QUALCOMM Incorporated
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US122553812025
Antenna Modules Employing Three-dimensional (3D) Build-up on Mold Package to Support Efficient Integration of Radio-frequency (RF) Circuitry, and Related Fabrication Methods
QUALCOMM Incorporated
0 cites
US122538852025
Electronic Device Including Flexible Display
Samsung Electronics Co., Ltd.
0 cites
US122180412025
Integrated Circuit (IC) Packages Employing a Capacitor-embedded, Redistribution Layer (RDL) Substrate for Interfacing an IC Chip(s) to a Package Substrate, and Related Methods
QUALCOMM INCORPORATED
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US122061552025
Radio Frequency Oscillator with Ceramic Resonator and Surface-mounted Integrated Circuit Package
QUALCOMM INCORPORATED
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US121553732024
Backend and Acoustic Process Integration for High-q Filter
QUALCOMM INCORPORATED
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US121534662024
Support Member Supporting Slidable Display and Electronic Device Including the Same
Samsung Electronics Co., Ltd.
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US121425612024
Integrated Device and Integrated Passive Device Comprising Magnetic Material
QUALCOMM INCORPORATED
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US120465302024
Thermal Bridge Interposer Structure
QUALCOMM INCORPORATED
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US120465452024
Hybrid Reconstituted Substrate for Electronic Packaging
QUALCOMM INCORPORATED
0 cites
US120402682024
Thin Film Resistor (TFR) Device Structure for High Performance Radio Frequency (RF) Filter Design
QUALCOMM Incorporated
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US120078082024
Foldable Electronic Device
Samsung Electronics Co., Ltd.
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US119848742024
Surface Acoustic Wave (SAW) Filter Packages Employing an Enhanced Thermally Conductive Cavity Frame for Heat Dissipation, and Related Fabrication Methods
QUALCOMM INCORPORATED
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US119603212024
Foldable Electronic Device Comprising Integrated-adhesive Layer and Adhesion Prevention Part
Samsung Electronics Co., Ltd
0 cites
US118943662024
Trench Capacitor Assembly for High Capacitance Density
QUALCOMM Incorporated
0 cites
US118760852024
Package with a Substrate Comprising an Embedded Capacitor with Side Wall Coupling
QUALCOMM INCORPORATED
0 cites
US118623672024
Esl-less AC Resistor for High Frequency Applications
QUALCOMM Incorporated
0 cites
US118308192023
Package Comprising Integrated Devices and Bridge Coupling Top Sides of Integrated Devices
QUALCOMM INCORPORATED
0 cites
US118173792023
Substrate Comprising an Inductor and a Capacitor Located in an Encapsulation Layer
QUALCOMM INCORPORATED
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US118173652023
Thermal Mitigation Die Using Back Side Etch
QUALCOMM INCORPORATED
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US117912262023
Device on Ceramic Substrate
QUALCOMM INCORPORATED
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US117697322023
Integrated Circuit (IC) with Reconstituted Die Interposer for Improved Connectivity, and Related Methods of Fabrication
QUALCOMM INCORPORATED
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US117497462023
Radio Frequency Front End (RFFE) Hetero-integration
QUALCOMM Incorporated
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US116891812023
Package Comprising Stacked Filters with a Shared Substrate Cap
QUALCOMM INCORPORATED
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US116706142023
Integrated Circuit Assembly with Hybrid Bonding
QUALCOMM INCORPORATED
0 cites
US116581032023
Capacitor Interposer Layer (CIL) Chiplet Design with Conformal Die Edge Pattern Around Bumps
QUALCOMM Incorporated
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US116520642023
Integrated Device with Electromagnetic Shield
QUALCOMM Incorporated
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US116524682023
High Performance Tunable Filter
QUALCOMM Incorporated
0 cites
US116521012023
Trench Capacitor Assembly for High Capacitance Density
QUALCOMM Incorporated
0 cites
US116316142023
MIM Capacitor with Adjustable Capacitance via Electronic Fuses
QUALCOMM Incorporated
0 cites
US116262362023
Stacked Inductor Having a Discrete Metal-stack Pattern
QUALCOMM Incorporated
0 cites
US116056202023
Three-dimensional (3D) Integrated Circuit with Passive Elements Formed by Hybrid Bonding
QUALCOMM INCORPORATED
0 cites
US115948042023
Antenna on Glass with Air Cavity Structure
QUALCOMM Incorporated
0 cites