Jonggu Lee

5 Patents

• US125558452026

  Battery Module, Battery Pack Including Battery Module, and Vehicle Including Battery Pack

  Kia Corporation

  0 cites
• US122986762025

  Substrate Processing Apparatus

  Samsung Electronics Co., Ltd.

  0 cites
• US118483012023

  Method of Manufacturing a Semiconductor Package

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US116263812023

  Bonding Head Including a Thermal Compensator, Die Bonding Apparatus Including the Same and Method of Manufacturing Semiconductor Package Using the Same

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US116077412023

  Semiconductor Chip Bonding Apparatus Including Head Having Thermally Conductive Materials

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites