20 Patents
- US126223022026Semiconductor Package Including a Lower Substrate and an Upper Substrate
Samsung Electronics Co., Ltd.
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- US125123982025Semiconductor Package Having Semiconductor Chip Positioned in Cavity of Cover Wiring Structure
Samsung Electronics Co., Ltd.
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- US122611572025Semiconductor Device Having Package on Package Structure and Method of Manufacturing the Semiconductor Device
SAMSUNG ELECTRONICS CO., Ltd.
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- US121487292024Semiconductor Package Structure Having Interposer Substrate, and Stacked Semiconductor Package Structure Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US120626052024Semiconductor Package Including an Interposer and Method of Fabricating the Same
SAMSUNG ELECTRONICS CO., Ltd.
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- US120210362024Semiconductor Package Including Interposer and Method of Manufacturing the Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
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- US118549892023Semiconductor Package Substrate and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US118044772023Semiconductor Device Having Package on Package Structure and Method of Manufacturing the Semiconductor Device
SAMSUNG ELECTRONICS CO., Ltd.
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- US116581072023Semiconductor Package Including an Interposer and Method of Fabricating the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US115812632023Semiconductor Package, and Package on Package Having the Same
SAMSUNG ELECTRONICS CO., Ltd.
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