Jong Sik Paek

14 Patents

• US126223102026

  Wafer Level Fan Out Semiconductor Device and Manufacturing Method Thereof

  AMKOR TECHNOLOGY SINGAPORE HOLDING PTE, Ltd.

  0 cites
• US126160532026

  Semiconductor Device and Manufacturing Method Thereof

  Amkor Technology Singapore Holding Pte. Ltd.

  0 cites
• US125435832026

  Stacked Die Modules for Semiconductor Device Assemblies and Methods of Manufacturing Stacked Die Modules

  Micron Technology, Inc.

  0 cites
• US123477372025

  Semiconductor Device with a Porous Air Vent

  Micron Technology, Inc.

  0 cites
• US121258162024

  Semiconductor Device Assemblies and Systems with One or More Dies at Least Partially Embedded in a Redistribution Layer (RDL) and Methods for Making the Same

  Micron Technology, Inc.

  0 cites
• US120516842024

  Face-to-face Semiconductor Device with Fan-out Porch

  Micron Technology, Inc.

  0 cites
• US119617422024

  Semiconductor Device and Manufacturing Method Thereof

  AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. Ltd.

  0 cites
• US119424552024

  Stacked Semiconductor Dies for Semiconductor Device Assemblies

  Micron Technology, Inc.

  0 cites
• US119424302024

  Stacked Die Modules for Semiconductor Device Assemblies and Methods of Manufacturing Stacked Die Modules

  Micron Technology, Inc.

  0 cites
• US119358562024

  Semiconductor Device Having a Redistribution Layer

  Amkor Technology Singapore Holding Pte. Ltd.

  0 cites
• US118550232023

  Wafer Level Fan Out Semiconductor Device and Manufacturing Method Thereof

  AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. Ltd.

  0 cites
• US118429702023

  Semiconductor Package and Manufacturing Method Thereof

  Amkor Technology Singapore Holding Pte. Ltd.

  0 cites
• US117641612023

  Ground Connection for Semiconductor Device Assembly

  Micron Technology, Inc.

  0 cites
• US117496652023

  Face-to-face Semiconductor Device with Fan-out Porch

  Micron Technology, Inc.

  0 cites