23 Patents
- US126222532026Semiconductor Device with Through Vias of Various Shapes and Method of Manufacturing the Same
SK Hynix Inc.
0 cites - 0 cites
- USD10866882025Frame for Crutches0 cites
- USD10866872025Frame for Crutches0 cites
- US122598382025Memory Controller, Method of Operating Memory Controller and Storage Device
Samsung Electronics Co., Ltd.
0 cites - 0 cites
- US122551262025Semiconductor Devices Including Substrates Bonded to Each Other and Methods for Fabricating the Same
SK Hynix Inc.
0 cites - US121932792025Display Device Including Color Absorbing Layer Between Capping and Bank Layers for Improving Color Matching, and Method of Providing the Same
SAMSUNG DISPLAY CO., Ltd.
0 cites - US121780682024Method of Fabricating Display Device Capable of Facilitating Substrate Bonding with Alignment Key
Samsung Display Co., Ltd.
0 cites - US121572652024Coupler for Air Suspension and Apparatus and Method for Manufacturing the Same
Hyundai Mobis Co., Ltd.
0 cites - 0 cites
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- US119032612024Display Device Including Color Absorbing Layer Between Capping and Bank Layers for Improving Color Matching, and Method of Providing the Same
SAMSUNG DISPLAY CO., Ltd.
0 cites - 0 cites
- US117871022023Coupler for Air Suspension and Apparatus and Method for Manufacturing the Same
SUNJIN CO., Ltd.
0 cites - US117514202023Display Device Capable of Facilitating Substrate Bonding with Alignment Key and Method of Fabricating the Same
Samsung Display Co., Ltd.
0 cites - 0 cites
- US116679162023Composition for Preventing or Treating Liver Fibrosis, Containing Exosome or Exosome-derived Ribonucleic Acid
Korea University Research And Business Foundation
0 cites - 0 cites
- US115692162023Semiconductor Package Including Stacked Semiconductor Chips and Method for Fabricating the Semiconductor Package
SK Hynix Inc.
0 cites - US115619192023Memory Controller, Method of Operating Memory Controller and Storage Device
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites