Jong Ho Shin

2 Patents

• US116886972023

  Emi Shielding for Flip Chip Package with Exposed Die Backside

  STATS Chippac Pte. Ltd.

  0 cites
• US116053052023

  Method, System, and Computer-readable Recording Medium for Providing Education Service Based on Knowledge Units

  KNOWRE KOREA Inc.

  0 cites