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John S. Guzek
Chandler, AZ
US
7 patents
6 Patents
US12557665
2026
Embedded Semiconductive Chips in Reconstituted Wafers, and Systems Containing Same
Intel Corporation
0 cites
USRE050796
2026
Semiconductor Package Having Spacer Layer
Exo Imaging, Inc.
0 cites
US12230582
2025
Embedded Die on Interposer Packages
Intel Corporation
0 cites
US12107042
2024
Localized High Density Substrate Routing
Intel Corporation
0 cites
US11984396
2024
Localized High Density Substrate Routing
Intel Corporation
0 cites
US11798892
2023
Embedded Die on Interposer Packages
Intel Corporation
0 cites