John Michael Cotte

8 Patents

• US125572102026

  Electronic Apparatus Minimizing Differential Thermal Contraction for Cryogenic Quantum Computers

  INTERNATIONAL BUSINESS MACHINES CORPORATION

  0 cites
• US123243612025

  Electrical Connections Between Dissimilar Materials at Cryogenic Temperatures

  INTERNATIONAL BUSINESS MACHINES CORPORATION

  0 cites
• US122497482025

  Edge Capacitive Coupling for Quantum Chips

  INTERNATIONAL BUSINESS MACHINES CORPORATION

  0 cites
• US121503902024

  Downstop and Bump Bonds Formation on Substrates

  INTERNATIONAL BUSINESS MACHINES CORPORATION

  0 cites
• US120339812024

  Create a Protected Layer for Interconnects and Devices in a Packaged Quantum Structure

  INTERNATIONAL BUSINESS MACHINES CORPORATION

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• US119087562024

  Interposer Chips and Enclosures for Quantum Circuits

  INTERNATIONAL BUSINESS MACHINES CORPORATION

  0 cites
• US118044422023

  Combined Backing Plate and Housing for Use in Bump Bonded Chip Assembly

  International Business Machines Corporation

  0 cites
• US116769032023

  Combined Backing Plate and Housing for Use in Bump Bonded Chip Assembly

  INTERNATIONAL BUSINESS MACHINES CORPORATION

  0 cites