John Mark Meldrim

9 Patents

• US123241572025

  Integrated Circuitry, Comprising a Pair of Opposing Lateral Projections in Insulating Material in a Cavity

  Micron Technology, Inc.

  0 cites
• US122951402025

  Memory Arrays Comprising Strings of Memory Cells and Methods Used in Forming a Memory Array Comprising Strings of Memory Cells

  Micron Technology, Inc.

  0 cites
• US121144922024

  Memories Having Vertically Stacked Conductive Filled Structures

  Micron Technology, Inc.

  0 cites
• US120340572024

  Assemblies Which Include Wordlines Having a First Metal-containing Material at Least Partially Surrounding a Second Metal-containing Material and Having Different Crystallinity Than the Second Metal-containing Material

  Micron Technology, Inc.

  0 cites
• US119905282024

  Assemblies Having Conductive Structures with Three or More Different Materials

  0 cites
• US118189682023

  Conductive Interconnects Suitable for Utilization in Integrated Assemblies, and Methods of Forming Conductive Interconnects

  Micron Technology, Inc.

  0 cites
• US117055002023

  Assemblies Having Conductive Structures with Three or More Different Materials

  Micron Technology, Inc.

  0 cites
• US116462062023

  Methods of Forming Tungsten Structures

  Micron Technology, Inc.

  0 cites
• US116476332023

  Methods Used in Forming Integrated Circuitry Comprising a Stack Comprising Vertically-alternating First Tiers and Second Tiers with the Stack Comprising a Cavity Therein That Comprises a Stair-step Structure

  Micron Technology, Inc.

  0 cites