John L. Klocke

13 Patents

• US125955812026

  Coplanarity Improvement of High-rate CU Pillar Processes Using High Agitation to Enable Use of High Acid, Low CU Chemistries

  APPLIED Materials, Inc.

  0 cites
• US124697202025

  Electroplating Wetting Chamber with Reduced Bubble Entrapment

  Applied Materials, Inc.

  0 cites
• US124045972025

  Electrochemical Depositions of Nanotwin Copper Materials

  Applied Materials, Inc.

  0 cites
• US123449552025

  Electroplating Co-planarity Improvement by Die Shielding

  Applied Materials, Inc.

  0 cites
• US122093252025

  Nanofiltration for Wafer Rinsing

  Applied Materials, Inc.

  0 cites
• US121881442025

  Wafer Immersion in Semiconductor Processing Chambers

  Applied Materials, Inc.

  0 cites
• US121462352024

  Plating and Deplating Currents for Material Co-planarity in Semiconductor Plating Processes

  Applied Materials, Inc.

  0 cites
• US121166862024

  Parameter Adjustment Model for Semiconductor Processing Chambers

  Applied Materials, Inc.

  0 cites
• US119820082024

  Electroplating System

  APPLIED Materials, Inc.

  0 cites
• US119730342024

  Nanotwin Copper Materials in Semiconductor Devices

  Applied Materials, Inc.

  0 cites
• US119012252024

  Diffusion Layers in Metal Interconnects

  Applied Materials, Inc.

  0 cites
• US116348302023

  Electrochemical Depositions of Nanotwin Copper Materials

  Applied Materials, Inc.

  0 cites
• US115784222023

  Electroplating System

  APPLIED MATERIALS, Inc.

  0 cites