12 Patents
- US125688462026Wafer Dies with Thermally Conducting Perimeter Regions
International Business Machines Corporation
0 cites - US123006152025Infrared Debond Damage Mitigation by Copper Fill Pattern
International Business Machines Corporation
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- US120148162024Multi-sensor Platform for Health Monitoring
International Business Machines Corporation
0 cites - US120150032024High Density Interconnection and Wiring Layers, Package Structures, and Integration Methods
International Business Machines Corporation
0 cites - 0 cites
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- US118108932023Silicon Interposer Sandwich Structure for ESD, EMC, and EMC Shielding and Protection
International Business Machines Corporation
0 cites - US117106692023Precision Thin Electronics Handling Integration
International Business Machines Corporation
0 cites - US115878602023Method of Forming Thin Die Stack Assemblies
International Business Machines Corporation
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