John J. Beatty

4 Patents

• US117768692023

  Package with a Highly Conductive Layer Deposited on Die Using Throughput Additive Deposition Prior to TIM1 Dispense

  Intel Corporation

  0 cites
• US116768732023

  Semiconductor Package Having Sealant Bridge

  Intel Corporation

  0 cites
• US116520182023

  Heat Spreader Edge Standoffs for Managing Bondline Thickness in Microelectronic Packages

  Intel Corporation

  0 cites
• US116520612023

  Package-level Backside Metallization (BSM)

  Intel Corporation

  0 cites