Patents/Inventors

John Hon-shing Lau

TaoyuanTW14 patents

12 Patents

US124128792025
Package Structure and Manufacturing Method Thereof
Unimicron Technology Corp.
0 cites
US124142432025
Manufacturing Method of Package Structure
Unimicron Technology Corp.
0 cites
US123099432025
Circuit Carrier and Manufacturing Method Thereof and Package Structure
Unimicron Technology Corp.
0 cites
US122666162025
Integrated Circuit Package Structure
Unimicron Technology Corp.
0 cites
US122438382025
Circuit Substrate Structure and Manufacturing Method Thereof
Unimicron Technology Corp.
0 cites
US118604282024
Package Structure and Optical Signal Transmitter
Unimicron Technology Corp.
0 cites
US118240122023
Integrated Circuit Package Structure and Method of Manufacturing the Same
Unimicron Technology Corp.
0 cites
US118087872023
Probe Card Testing Device
Unimicron Technology Corp.
0 cites
US117106902023
Package Structure and Manufacturing Method Thereof
Unimicron Technology Corp.
0 cites
US116826122023
Package Structure and Manufacturing Method Thereof
Unimicron Technology Corp.
0 cites
US116658322023
Circuit Board Structure and Manufacturing Method Thereof
Unimicron Technology Corp.
0 cites
US115629722023
Manufacturing Method of the Chip Package Structure Having at Least One Chip and at Least One Thermally Conductive Element
Unimicron Technology Corp.
0 cites