5 Patents
- US124944412025BGA Stiffener Attachment with Low Eolife Adhesive Strength at High Solder Joint Stress Area Generated from Enabling Load
Intel Corporation
0 cites - US121836882024Integrated Circuit Die Package Stiffeners of Metal Alloys Having Exceptionally High CTE
Intel Corporation
0 cites - US120402462024Chip-scale Package Architectures Containing a Die Back Side Metal and a Solder Thermal Interface Material
Intel Corporation
0 cites - 0 cites
- US116942102023Systems and Non-transitory Computer-readable Storage Media for Real-time Event Management System for Mobile Devices
Likewize Corp.
0 cites