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John G. Meyers
Sacramento, CA
US
4 patents
4 Patents
US12068283
2024
Die Stack with Cascade and Vertical Connections
Intel Corporation
0 cites
US11901274
2024
Packaged Integrated Circuit Device with Recess Structure
Intel Corporation
0 cites
US11817438
2023
System in Package with Interconnected Modules
Intel Corporationd
0 cites
US11552051
2023
Electronic Device Package
Intel Corporation
0 cites