14 Patents
- US124328842025Conforming Heat Transport Device for Dual Inline Memory Module Cooling Applications
Hewlett Packard Enterprise Development LP
0 cites - US123099692025Receptacle with Connectable Spring Finger for Multipoint Contact Conduction Cooling
Hewlett Packard Enterprise Development LP
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- US119744142024Conforming Heat Transport Device for Dual Inline Memory Module Cooling Applications
Hewlett Packard Enterprise Development LP
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- US117857432023Temperature Control of Closely Packed Electronic Assemblies
Hewlett Packard Enterprise Development LP
0 cites - US117299342023System for Securing a Computing System in a Host Infrastructure
Hewlett Packard Enterprise Development LP
0 cites - US117299432023Receptacle with Connectable Spring Finger for Multipoint Contact Conduction Cooling
Hewlett Packard Enterprise Patent Department LP
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- US115796682023Multipoint Contact Conduction Cooling of a Removable Device
Hewlett Packard Enterprise Development LP
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