John F. Valley

3 Patents

• US122707682025

  Method of Processing a Cleaved Semiconductor Wafer

  Globalwafers Co., Ltd.

  0 cites
• US120190312024

  Cleaved Semiconductor Wafer Imaging System

  Globalwafers Co., Ltd.

  0 cites
• US119210542024

  Cleaved Semiconductor Wafer Camera System

  Globalwafers Co., Ltd.

  0 cites