Patents/Inventors

John C. Decker

Tempe, AZUS2 patents

3 Patents

US124179582025
Microelectronics Package Comprising a Package-on-package (pop) Architecture with Inkjet Barrier Material for Controlling Bondline Thickness and Pop Adhesive Keep Out Zone
Intel Corporation
0 cites
US123477432025
Microelectronics Package Comprising a Package-on-package (pop) Architecture with Inkjet Barrier Material for Controlling Bondline Thickness and Pop Adhesive Keep Out Zone
Intel Corporation
0 cites
US123157772025
Microelectronics Package Comprising a Package-on-package (POP) Architecture with Inkjet Barrier Material for Controlling Bondline Thickness and POP Adhesive Keep Out Zone
Intel Corporation
0 cites