Patents/Inventors

Johanna Swan

Scottsdale, AZUS43 patents

35 Patents

US126047542026
Package Structures with Non-uniform Interconnect Features
Intel Corporation
0 cites
US125507682026
Conformal Power Delivery Structures Near High-speed Signal Traces
Intel Corporation
0 cites
US125327402026
Porous Mesh Structures for the Thermal Management of Integrated Circuit Devices
Intel Corporation
0 cites
US124890322025
Cooling of Conformal Power Delivery Structures
Intel Corporation
0 cites
US124567022025
Device, Method and System to Mitigate Stress on Hybrid Bonds in a Multi-tier Arrangement of Chiplets
Intel Corporation
0 cites
US124245432025
Selective Interconnects in Back-end-of-line Metallization Stacks of Integrated Circuitry
Intel Corporation
0 cites
US123622842025
Composite Interposer Structure and Method of Providing Same
Intel Corporation
0 cites
US123277752025
Thermal Performance in Hybrid Bonded 3D Die Stacks
Intel Corporation
0 cites
US123157942025
Skip Level Vias in Metallization Layers for Integrated Circuit Devices
Intel Corporation
0 cites
US123005792025
Liquid Cooled Interposer for Integrated Circuit Stack
Intel Corporation
0 cites
US122887462025
Skip Level Vias in Metallization Layers for Integrated Circuit Devices
Intel Corporation
0 cites
US122653892025
Technologies for Providing a Cognitive Capacity Test for Autonomous Driving
Mobileye Vision Technologies Ltd.
0 cites
US122668402025
Waveguide Interconnects for Semiconductor Packages and Related Methods
Intel Corporation
0 cites
US122242612025
Mixed Hybrid Bonding Structures and Methods of Forming the Same
Intel Corporation
0 cites
US122059022025
High-density Interconnects for Integrated Circuit Packages
Intel Corporation
0 cites
US121702442024
High-throughput Additively Manufactured Power Delivery Vias and Traces
Intel Corporation
0 cites
US121425432024
Thermal Management Solutions for Embedded Integrated Circuit Devices
Intel Corporation
0 cites
US120876822024
Power Delivery Structures
Intel Corporation
0 cites
US120149902024
Composite Interposer Structure and Method of Providing Same
Intel Corporation
0 cites
US119335552024
Heat Dissipation Device Having Anisotropic Thermally Conductive Sections and Isotropic Thermally Conductive Sections
Intel Corporation
0 cites
US118428262023
Additive Manufacturing for Integrated Circuit Assembly Connector Support Structures
Intel Corporation
0 cites
US118308312023
Semiconductor Package Including a Modular Side Radiating Waveguide Launcher
Intel Corporation
0 cites
US118239722023
Thermal Management Solutions That Reduce Inductive Coupling Between Stacked Integrated Circuit Devices
Intel Corporation
0 cites
US117496492023
Composite IC Chips Including a Chiplet Embedded Within Metallization Layers of a Host IC Chip
Intel Corporation
0 cites
US116949512023
Zero-misalignment Two-via Structures
Intel Corporation
0 cites
US116949862023
Vias in Composite IC Chip Structures
Intel Corporation
0 cites
US116886652023
Thermal Management Solutions for Stacked Integrated Circuit Devices
Intel Corporation
0 cites
US116643032023
Interconnection Structure Fabrication Using Grayscale Lithography
Intel Corporation
0 cites
US116520592023
Composite Interposer Structure and Method of Providing Same
Intel Corporation
0 cites
US116520742023
Semiconductor Package with Improved Thermal Blocks
Intel Corporation
0 cites
US116212082023
Thermal Management Solutions That Reduce Inductive Coupling Between Stacked Integrated Circuit Devices
Intel Corporation
0 cites
US116159982023
Thermal Management Solutions for Embedded Integrated Circuit Devices
Intel Corporation
0 cites
US115948012023
Mmwave Dielectric Waveguide Interconnect Topology for Automotive Applications
Intel Corporation
0 cites
US115812382023
Heat Spreading Layer Integrated Within a Composite IC Die Structure and Methods of Forming the Same
Intel Corporation
0 cites
US115515512023
Technologies for Providing Guidance for Autonomous Vehicles in Areas of Low Network Connectivity
Intel Corporation
0 cites