Patents/Inventors

Johanna M. Swan

Scottsdale, AZUS76 patents

80 Patents

US125990332026
Quasi-monolithic Integrated Packaging Architecture with Mid-die Serializer/deserializer
Intel Corporation
0 cites
US125819382026
Package Architecture for Quasi-monolithic Chip with Backside Power
Intel Corporation
0 cites
US125819682026
Package Architecture of Large Dies Using Quasi-monolithic Chip Layers
Intel Corporation
0 cites
US125388412026
Quasi-monolithic Die Architectures
Intel Corporation
0 cites
US125001772025
Microelectronic Assemblies with Communication Networks
Intel Corporation
0 cites
US125002072025
Packaging Architecture with Intermediate Routing Layers
Intel Corporation
0 cites
US124891892025
Contactless Communication Using a Waveguide Extending Through a Substrate Core
Intel Corporation
0 cites
US124698202025
Fine-grained Disaggregated Server Architecture
Intel Corporation
0 cites
US124245892025
Contiguous Shield Structures in Microelectronic Assemblies Having Hybrid Bonding
Intel Corporation
0 cites
US124179782025
Microelectronic Assemblies Having Backside Die-to-package Interconnects
Intel Corporation
0 cites
US124128812025
Microelectronic Assemblies
Intel Corporation
0 cites
US123811822025
Direct Bonding in Microelectronic Assemblies
Intel Corporation
0 cites
US123477612025
Magnetic Planar Spiral and High Aspect Ratio Inductors for Power Delivery in the Glass-core of a Package Substrate
Intel Corporation
0 cites
US123277942025
Die Coupling Using a Substrate with a Glass Core
Intel Corporation
0 cites
US123277952025
Waveguide Interconnect Bridges
Intel Corporation
0 cites
US123278272025
Microelectronic Assemblies
Intel Corporation
0 cites
US123158402025
Microelectronic Assemblies
Intel Corporation
0 cites
US123006262025
Microelectronic Assemblies
Intel Corporation
0 cites
US123006662025
Microelectronic Assemblies with Communication Networks
Intel Corporation
0 cites
US122887512025
Microelectronic Assemblies
Intel Corporation
0 cites
US122666822025
Capacitors and Resistors at Direct Bonding Interfaces in Microelectronic Assemblies
Intel Corporation
0 cites
US122610972025
Thermal Management in Integrated Circuit Packages
Intel Corporation
0 cites
US121990182025
Direct Bonding in Microelectronic Assemblies
Intel Corporation
0 cites
US121990632025
Microelectronic Assemblies
Intel Corporation
0 cites
US121839612024
Methods for Conductively Coating Millimeter Waveguides
Intel Corporation
0 cites
US121763232024
Microelectronic Assemblies
Intel Corporation
0 cites
US121659622024
Hermetic Sealing Structures in Microelectronic Assemblies Having Direct Bonding
Intel Corporation
0 cites
US121553722024
Multi-filter Die
Intel Corporation
0 cites
US121487472024
Gallium Nitride (GAN) Three-dimensional Integrated Circuit Technology
Intel Corporation
0 cites
US121502712024
Platforms Including Microelectronic Packages Therein Coupled to a Chassis, Where Waveguides Couple the Microelectronic Packages to Each Other and Usable in a Computing Device
Intel Corporation
0 cites
US121425102024
Carrier for Microelectronic Assemblies Having Direct Bonding
Intel Corporation
0 cites
US121365962024
Microelectronic Assemblies
Intel Corporation
0 cites
US121192912024
Hermetic Sealing Structures in Microelectronic Assemblies Having Direct Bonding
Intel Corporation
0 cites
US121130262024
Multi-chip Package and Method of Providing Die-to-die Interconnects in Same
Intel Corporation
0 cites
US121130482024
Microelectronic Assemblies
Intel Corporation
0 cites
US121070602024
Microelectronic Assemblies with Inductors in Direct Bonding Regions
Intel Corproation
0 cites
US120806522024
Microelectronic Assemblies with Communication Networks
Intel Corporation
0 cites
US120626312024
Microelectronic Assemblies with Inductors in Direct Bonding Regions
Intel Corporation
0 cites
US120574022024
Direct Bonding in Microelectronic Assemblies
Intel Corporation
0 cites
US120407762024
Integrated Radio Frequency (RF) Front-end Module (FEM)
Intel Corporation
0 cites
US120071702024
Thermal Management in Integrated Circuit Packages
Intel Corporation
0 cites
US119904482024
Direct Bonding in Microelectronic Assemblies
Intel Corporation
0 cites
US119844392024
Microelectronic Assemblies
Intel Corporation
0 cites
US119675802024
Microelectronic Assemblies with Communication Networks
Intel Corporation
0 cites
US119160062024
Microelectronic Assemblies Having an Integrated Voltage Regulator Chiplet
Intel Corporation
0 cites
US119160202024
Microelectronic Assemblies with Communication Networks
Intel Corporation
0 cites
US119013302024
Microelectronic Assemblies
Intel Corporation
0 cites
US118943242024
In-package RF Waveguides as High Bandwidth Chip-to-chip Interconnects and Methods for Using the Same
Intel Corporation
0 cites
US118814572024
Semiconductor Packaging with High Density Interconnects
Tahoe Research, Ltd.
0 cites
US118760532024
Multi-chip Package and Method of Providing Die-to-die Interconnects in Same
Intel Corporation
0 cites
US118307872023
Thermal Management in Integrated Circuit Packages
Intel Corporation
0 cites
US118240082023
Multi-chip Package and Method of Providing Die-to-die Interconnects in Same
Intel Corporation
0 cites
US117912772023
Microelectronic Assemblies
Intel Corporation
0 cites
US117841082023
Thermal Management in Integrated Circuit Packages
Intel Corporation
0 cites
US117841812023
Die Backend Diodes for Electrostatic Discharge (ESD) Protection
Intel Corporation
0 cites
US117768692023
Package with a Highly Conductive Layer Deposited on Die Using Throughput Additive Deposition Prior to TIM1 Dispense
Intel Corporation
0 cites
US117697342023
Microelectronic Assemblies
Intel Corporation
0 cites
US117697512023
Microelectronic Assemblies
Intel Corporation
0 cites
US117644522023
Integrated Circuit Including a Dielectric Waveguide with a Cavity Therein Surrounded by a Conductive Coating Forming a Wall for the Cavity
Intel Corporation
0 cites
US117569432023
Microelectronic Assemblies
Intel Corporation
0 cites
US117496282023
Sacrificial Redistribution Layer in Microelectronic Assemblies Having Direct Bonding
Intel Corporation
0 cites
US117496422023
Microelectronic Assemblies with Communication Networks
Intel Corporation
0 cites
US117513672023
Microelectronic Package Electrostatic Discharge (ESD) Protection
Intel Corporation
0 cites
US117282902023
Waveguide Fan-out
Intel Corporation
0 cites
US117216492023
Microelectronic Assemblies
Intel Corporation
0 cites
US117156932023
Dielectric Waveguide Channel for Interconnecting Dies in a Semiconductor Package Usable in a Computing Device and Method of Manufacture
Intel Corporation
0 cites
US117168262023
Platforms Including Microelectronic Packages Therein Coupled to a Chassis, Where Waveguides Couple the Microelectronic Packages to Each Other and Usable in a Computing Device
Intel Corporation
0 cites
US116949622023
Microelectronic Package with Mold-integrated Components
Intel Corporation
0 cites
US116886602023
Bridge for Radio Frequency (RF) Multi-chip Modules
Intel Corporation
0 cites
US116769182023
Electrostatic Discharge Protection in Integrated Circuits
Intel Corporation
0 cites
US116417112023
Microelectronic Package with Substrate-integrated Components
Intel Corporation
0 cites
US116211922023
Inorganic Dies with Organic Interconnect Layers and Related Structures
Intel Corporation
0 cites
US116212362023
Electrostatic Discharge Protection in Integrated Circuits Using Positive Temperature Coefficient Material
Intel Corporation
0 cites
US116160472023
Microelectronic Assemblies
Intel Corporation
0 cites
US116056032023
Microelectronic Package with Radio Frequency (RF) Chiplet
Intel Corporation
0 cites
US116005942023
Microelectronic Assemblies
Intel Corporation
0 cites
US115812722023
Contactless High-frequency Interconnect
Intel Corporation
0 cites
US115812822023
Serializer-deserializer Die for High Speed Signal Interconnect
Intel Corporation
0 cites
US115757492023
Low-weight Single Mm-wave Dielectric Waveguide Interconnect Architecture in Autonomous Cars
Intel Corporation
0 cites
US115694282023
Superconducting Qubit Device Packages
Santa Clara
0 cites