Patents/Inventors

Johann Gatterbauer

ParsbergDE2 patents

3 Patents

US120402882024
Chip Package and Method of Forming a Chip Package
Infineon Technologies AG
0 cites
US120339722024
Chip Package, Method of Forming a Chip Package and Method of Forming an Electrical Contact
Infineon Technologies AG
0 cites
US117355342023
Chip Package and Method of Forming a Chip Package
Infineon Technologies AG
0 cites