Joerg Siegert

3 Patents

• US121006442024

  Semiconductor Device with Through-substrate via and Method of Manufacturing a Semiconductor Device with Through-substrate Via

  AMS AG

  0 cites
• US116972012023

  Exoskeleton System, Control Device, and Method

  Universitaet Stuttgart

  0 cites
• US115722712023

  Method for Manufacturing an Etch Stop Layer and MEMS Sensor Comprising an Etch Stop Layer

  AMS AG

  0 cites