Patents/Inventors

Joe Walczyk

Tigard, ORUS7 patents

8 Patents

US124827792025
Hybrid Backside Thermal Structures for Enhanced Ic Packages
Intel Corporation
0 cites
US121365772024
Integrated Circuit Die Packages Including a Contiguous Heat Spreader
Intel Corporation
0 cites
US120876582024
Hybrid Thermal Interface Material (TIM) with Reduced 3D Thermal Resistance
Intel Corporation
0 cites
US120806202024
Additively Manufactured Structures for Heat Dissipation from Integrated Circuit Devices
Intel Corporation
0 cites
US120096122024
Dual-sided Socket Device with Corrugation Structures and Shield Structures
Intel Corporation
0 cites
US119489062024
Hybrid Backside Thermal Structures for Enhanced IC Packages
Intel Corporation
0 cites
US116562472023
Micro-coaxial Wire Interconnect Architecture
Intel Corporation
0 cites
US116395562023
Massively-parallel Micronozzle Array for Direct Write Electrodeposition of High-density Microstructure Arrays
Intel Corporation
0 cites