Joe Paul Moolanmoozha

4 Patents

• US125685972026

  Staged High-density Backplane for Electronic Modules

  Western Digital Technologies, Inc.

  0 cites
• US124328552025

  Multiple Circuit Board Assembly Including a Support Element and Method of Manufacture Thereof

  Sandisk Technologies, Inc.

  0 cites
• US123527802025

  Integrated Circuit Test Socket with Integrated Device Picking Mechanism

  Sandisk Technologies, Inc.

  0 cites
• US116871322023

  Crossflow Air Deflector for High Density Independent Airflow Control

  Western Digital Technologies, Inc.

  0 cites