7 Patents
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- US123666152025Current Sensor That Includes a Current Rail and a Magnetic Field Sensor with Galvanic Isolation
Infineon Technologies AG
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- US120339722024Chip Package, Method of Forming a Chip Package and Method of Forming an Electrical Contact
Infineon Technologies AG
0 cites - US118513222023Microelectromechanical System (MEMS) Sensor Packages and Methods for Producing Microelectromechanical System Sensor Packages Having a Plurality of MEMS Sensor Chips
Infineon Technologies AG
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