4 Patents
- US125989772026Fill of Vias in Single and Dual Damascene Structures Using Self-assembled Monolayer
Intel Corporation
0 cites - US125001622025Staggered Vertically Spaced Integrated Circuit Line Metallization with Differential Vias and Metal-selective Deposition
Intel Corporation
0 cites - US124827442025Subtractively Patterned Interconnect Structures for Integrated Circuits
Intel Corporation
0 cites - US120274582024Subtractively Patterned Interconnect Structures for Integrated Circuits
Intel Corporation
0 cites