Patents/Inventors

Jiun Hann Sir

GelugorMY18 patents

11 Patents

US126047622026
Methods and Apparatus to Reduce Thickness of On-package Memory Architectures
Intel Corporation
0 cites
US125885112026
Shielding Assembly for Semiconductor Packages
Intel Corporation
0 cites
US125001552025
Electronic Package with Passive Component Between Substrates
Intel Corporation
0 cites
US124009522025
Stripped Redistrubution-layer Fabrication for Package-top Embedded Multi-die Interconnect Bridge
Intel Corporation
0 cites
US119292952024
Multi-use Package Architecture
Intel Corporation
0 cites
US119087932024
Stripped Redistrubution-layer Fabrication for Package-top Embedded Multi-die Interconnect Bridge
Intel Corporation
0 cites
US118239942023
Systems and Apparatuses for Implementing a Pad on Solder Mask (POSM) Semiconductor Substrate Package
Intel Corporation
0 cites
US116996442023
Organic Mold Interconnects in Shielded Interconnects Frames for Integrated-circuit Packages
Intel Corporation
0 cites
US116581112023
Stripped Redistrubution-layer Fabrication for Package-top Embedded Multi-die Interconnect Bridge
Intel Corporation
0 cites
US116581272023
RFI Free Picture Frame Metal Stiffener
Intel Corporation
0 cites
US115878442023
Electronic Device Package on Package (POP)
Intel Corporation
0 cites