9 Patents
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- US119087972024Integrated Circuit Device Having a Bit Line and a Main Insulating Spacer with an Extended Portion
Samsung Electronics Co., Ltd.
0 cites - US117641922023Semiconductor Package Including Underfill Material Layer and Method of Forming the Same
Samsung Electronics Co., Ltd.
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- US116769252023Semiconductor Packages Having Improved Reliability in Bonds Between Connection Conductors and Pads and Methods of Manufacturing the Same
Samsung Electronics Co., Ltd.
0 cites - US116581412023Die-to-wafer Bonding Structure and Semiconductor Package Using the Same
SAMSUNG ELECTRONICS CO., Ltd.
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