17 Patents
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- US123006712025Semiconductor Packages and Methods of Manufacturing the Semiconductor Packages
Samsung Electronics Co., Ltd.
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- US118109002023Semiconductor Packages Stacked by Wafer Bonding Process and Methods of Manufacturing the Semiconductor Packages
Samsung Electronics Co., Ltd.
0 cites - US117911372023Apparatus for Etching Substrate Bevel and Semiconductor Fabrication Method Using the Same
Samsung Electronics Co., Ltd.
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- US116643162023Semiconductor Devices Having Penetration Vias with Portions Having Decreasing Widths
Samsung Electronics Co., Ltd.
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