Patents/Inventors

Jinhyun Kang

Cheongju-siKR1 patent

2 Patents

US120210322024
Semiconductor Package Having an Interposer and Method of Manufacturing Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116949612023
Semiconductor Package Having an Interposer and Method of Manufacturing Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites