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Jinho An
Seoul
KR
3 patents
3 Patents
US12142541
2024
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US12021034
2024
Semiconductor Package and Method of Manufacturing the Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US11978688
2024
Semiconductor Device Having via Protective Layer
SAMSUNG ELECTRONICS CO., Ltd.
0 cites