26 Patents
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- US124446392025Semiconductor Device and Method for Reducing Metal Burrs Using Laser Grooving
STATS Chippac Pte. Ltd.
0 cites - US124446942025Semiconductor Device and Method of Forming Selective EMI Shielding with Slotted Substrate
STATS Chippac Pte. Ltd.
0 cites - US124380992025Semiconductor Device and Method of Forming EMI Shielding Material in Two-step Process to Avoid Contaminating Electrical Connector
STATS Chippac Pte. Ltd.
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- US123947272025Semiconductor Device and Method for Forming Electromagnetic Interference (EMI) Shielded Packages with Laser-based Redistribution and Multi-stacked Packages
STATS Chippac Pte. Ltd.
0 cites - US123745932025Semiconductor Device and Method of Forming Electrical Circuit Pattern Within Encapsulant of Sip Module
STATS Chippac Pte. Ltd.
0 cites - US123622872025Semiconductor Device and Method of Making Double Shielding Layers Over the Semiconductor Device
STATS Chippac Pte. Ltd.
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- US122551522025Semiconductor Device and Method of Forming a Slot in EMI Shielding with Improved Removal Depth
STATS Chippac Pte. Ltd.
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- US119232602024Semiconductor Device and Method of Forming Electrical Circuit Pattern Within Encapsulant of SIP Module
STATS Chippac Pte. Ltd.
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- US117568972023Semiconductor Device and Method of Forming a Slot in EMI Shielding with Improved Removal Depth
STATS Chippac Pte. Ltd.
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- US116520652023Semiconductor Device and Method of Embedding Circuit Pattern in Encapsulant for SIP Module
STATS Chippac Pte. Ltd.
0 cites - US116409442023Semiconductor Device and Method of Forming a Slot in EMI Shielding Layer Using a Plurality of Slot Lines to Guide a Laser
STATS Chippac Pte. Ltd.
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- US115812332023Semiconductor Device and Method of Forming Electrical Circuit Pattern Within Encapsulant of SIP Module
STATS Chippac Pte. Ltd.
0 cites