Patents/Inventors

Jingu Kim

Suwon-siKR12 patents

12 Patents

US125754182026
Semiconductor Packages Having Organic Material Layer Between Through-via Structure and Encapsulant That Surrounds a Portion of Semiconductor Chip
Samsung Electronics Co., Ltd.
0 cites
US124531072025
Semiconductor Device and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US121836942024
Semiconductor Package Including Antenna
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US121548732024
Semiconductor Package Including Antenna
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120402482024
Semiconductor Package Including Heat Spreader Layer
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120402992024
Semiconductor Package and Method of Manufacturing the Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119730422024
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US119424342024
Method of Manufacturing a Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US117355532023
Semiconductor Package and Method of Manufacturing the Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116370792023
Semiconductor Package Including Antenna
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115695632023
Semiconductor Packages and Method of Manufacturing Semiconductor Packages
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115629392023
Semiconductor Package Including Heat Spreader Layer
SAMSUNG ELECTRONICS CO., Ltd.
0 cites