Patents/Inventors

Jing-en Luan

SingaporeSG11 patents

12 Patents

US124944472025
Low Cost Wafer Level Packages and Silicon
Stmicroelectronics Pte Ltd
0 cites
US123681252025
Package with Polymer Pillars and Raised Portions
STMICROELECTRONICS PTE Ltd
0 cites
US123549862025
Wafer Level Chip Scale Package Having Varying Thicknesses
STMICROELECTRONICS PTE Ltd
0 cites
US122666362025
Stacked Die Package Including a Multi-contact Interconnect
STMICROELECTRONICS PTE Ltd
0 cites
US122306192025
Low Profile Sensor Packages
STMICROELECTRONICS PTE Ltd
0 cites
US121836462024
Semiconductor Device with a Dielectric Between Portions
STMICROELECTRONICS PTE Ltd
0 cites
US121762202024
Optical Sensor Package and Method of Making an Optical Sensor Package
Stmicroelectronics Pte Ltd
0 cites
US120028982024
Embedded Wafer Level Optical Sensor Packaging
STMICROELECTRONICS PTE Ltd
0 cites
US119887432024
Molded Proximity Sensor
STMICROELECTRONICS PTE Ltd
0 cites
US118288772023
Optical Sensor Package with Encapsulant Is Between and Separates Substrates and Multiple Assemblies
Stmicroelectronics PTE Ltd
0 cites
US117216572023
Wafer Level Chip Scale Package Having Varying Thicknesses
STMICROELECTRONICS PTE Ltd
0 cites
US115812322023
Semiconductor Device with a Dielectric Between Portions
STMICROELECTRONICS PTE Ltd
0 cites