Patents/Inventors

Jindong Feng

Jiangsu ProvinceCN24 patents

11 Patents

US126222922026
Two-sided Interconnected Embedded Chip Packaging Structure and Manufacturing Method Therefor
Zhuhai ACCESS Semiconductor Co., Ltd
0 cites
US126044142026
Temporary Carrier Plate and Manufacturing Method Thereof, and Manufacturing Method for Packaging Substrate
Nantong ACCESS Semiconductor CO., Ltd.
0 cites
US125507742026
Carrier Plate for Preparing Package Substrate, Package Substrate Structure and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd
0 cites
US124762302025
Embedded Packaging Structure and Method for Manufacturing the Same
ZHUHAI ACCESS SEMICONDUCTOR CO., Ltd
0 cites
US124630552025
Package Substrate Manufacturing Method
NEXPERIA B.V.
0 cites
US124128432025
Support Frame Structure and Manufacturing Method Thereof
ZHUHAI ACCESS SEMICONDUCTOR CO., Ltd.
0 cites
US121486762024
Embedded Chip Package and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd.
0 cites
US120405262024
Method for Manufacturing Embedded Package Structure Having Air Resonant Cavity
Zhuhai ACCESS Semiconductor Co., Ltd.
0 cites
US120027342024
Circuit Prearranged Heat Dissipation Embedded Packaging Structure and Manufacturing Method Thereof
ZHUHAI ACCESS SEMICONDUCTOR CO., Ltd
0 cites
US118549202023
Embedded Chip Package and Manufacturing Method Thereof
Zhuhai ACCESS Semiconductor Co., Ltd.
0 cites
US115691772023
Support Frame Structure and Manufacturing Method Thereof
ZHUHAI ACCESS SEMICONDUCTOR CO., Ltd
0 cites