Patents/Inventors

Jin Won Lee

Suwon-siKR46 patents

40 Patents

US126205872026
Positive Electrode Active Material and Lithium Secondary Battery Including the Same
ECOPRO BM CO., Ltd.
0 cites
US125934032026
Printed Circuit Board
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US125801782026
Positive Electrode Active Material and Lithium Secondary Battery Including the Same
ECOPRO BM CO., Ltd.
0 cites
US124504862025
Depth-first Deep Convolutional Neural Network Inference
QUALCOMM Incorporated
0 cites
US124128222025
Semiconductor Chip and Semiconductor Package Including the Same
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US122794902025
Display Device Having Electrostatic Protection Circuit
SAMSUNG DISPLAY CO., Ltd.
0 cites
US122512402025
Method for Displaying Biometrics Information
ISENS, Inc.
0 cites
US122507662025
Antenna Module
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US122202322025
Apparatus for Controlling Operations of Continuous Glucose Monitoring System
I-SENS, Inc.
0 cites
US122196922025
Printed Circuit Board
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US122057472025
Coil Component
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US121931602025
Printed Circuit Board
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US121360382024
Gradient Pruning for Efficient Training of Machine Learning Models
QUALCOMM Incorporated
0 cites
US121203282024
Transmission Device of Point Cloud Data and Method Performed by Transmission Device, and Reception Device of Point Cloud Data and Method Performed by Reception Device
LG ELECTRONICS Inc.
0 cites
US120876862024
Semiconductor Memory Device and Manufacturing Method of the Semiconductor Memory Device
SK Hynix Inc.
0 cites
US120572532024
Coil Component
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US120208492024
Coil Component
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US119784032024
Display Device and Driving Method Thereof
Samsung Display Co., Ltd.
0 cites
US119485592024
Automatic Grammar Augmentation for Robust Voice Command Recognition
QUALCOMM Incorporated
0 cites
US119106042024
Semiconductor Device and Method of Manufacturing the Same
SK Hynix Inc.
0 cites
US119013592024
Method of Manufacturing a Semiconductor Device
SAMSUNG ELECTRONICS CO., Ltd
0 cites
US118715702024
Semiconductor Device and Method of Manufacturing the Same
SK Hynix Inc.
0 cites
US118715682024
Semiconductor Device
SK Hynix Inc.
0 cites
US118643072024
Printed Circuit Board
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US118188412023
Printed Circuit Board
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US117708982023
Substrate Structure and Electronic Device Including the Same
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US117586502023
Flexible Printed Circuit Board and Electronic Device Including the Same
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US117586552023
Printed Circuit Board
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US117586462023
Antenna Module
Samsung Electro-mechanics Co., Ltd.
0 cites
US117440122023
Printed Circuit Board and Substrate Including Electronic Component Embedded Therein
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US117358142023
Antenna Module
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US117045712023
Learned Threshold Pruning for Deep Neural Networks
QUALCOMM Incorporated
0 cites
US116886822023
Semiconductor Memory Device and Manufacturing Method of the Semiconductor Memory Device
SK Hynix Inc.
0 cites
US116581132023
Semiconductor Memory Device and Manufacturing Method of the Semiconductor Memory Device
SK Hynix Inc.
0 cites
US116316432023
Substrate Embedded Electronic Component Package
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US116083512023
Crystal Structure-modulated Zeolitic Imidazolate Framework Nanoparticles and Method of Producing the Same
0 cites
US115878782023
Substrate Having Electronic Component Embedded Therein
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US115803562023
Efficient Inferencing with Piecewise Pointwise Convolution
Qualcomm Incorporated
0 cites
US115762612023
Connection Structure Embedded Substrate
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites
US115551122023
Composition for Rack Housing Member of Vehicle Having Excellent Dimensional Stability and Rack Housing Member of Vehicle Prepared Using the Same
HYUNDAI ADVANCED MATERIALS CO., Ltd.
0 cites