Jin Won Jeong

4 Patents

• US124566512025

  Semiconductor Die Forming and Packaging Method Using Ultrashort Pulse Laser Micromachining

  Magnachip Semiconductor, Ltd.

  0 cites
• US119013222024

  Fabrication Method of Semiconductor Die and Chip-on-plastic Packaging of Semiconductor Die

  Magnachip Semiconductor, Ltd.

  0 cites
• US118878922024

  Method for Forming Semiconductor Die with Die Region and Seal-ring Region

  Magnachip Semiconductor, Ltd.

  0 cites
• US116050522023

  Systems and Methods for Electronic Monitoring of Inventory Transfer

  Coupang Corp.

  0 cites