31 Patents
- US125932832026Non-infrastructure Ultra-wideband Wireless Positioning Method and System Using Latency Communication and Overhear
AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
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- US124351882025Method for Preparing Biodegradable Polymer Microparticles, and Biodegradable Polymer Microparticles Prepared Thereby
SAMYANG HOLDINGS CORPORATION
0 cites - US123549962025Glass Carrier for Die-up Fan-out Packaging and Methods for Making the Same
CORNING INCORPORATED
0 cites - US123266042025Integrated Circuit Packages Having Electrical and Optical Connectivity and Methods of Making the Same
Corning Incorporated
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- US122285752025Biomarker Composition for Predicting Cancer Malignant Prognosis Induced by Microplastic Exposure
KOREA INSTITUTE OF RADIOLOGICAL & MEDICAL SCIENCES
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- US120843732024Glass Carriers for Fan-out Packaging Having Target Coefficients of Thermal Expansion and Methods for Making the Same
CORNING INCORPORATED
0 cites - US120847982024Apparatus and Method for Manufacturing Fibrous Web, Fibrilla Fiber Aggregate, or Nonwoven Fabric, and Fibrous Web, Fibrilla Fiber Aggregate, or Nonwoven Fabric Manufactured Thereby
SAMYANG HOLDINGS CORPORATION
0 cites - US120769712024Laminated Glass Structures for Electronic Devices and Electronic Device Substrates
CORNING INCORPORATED
0 cites - US120649382024Glass Laminates Having Determined Stress Profiles and Methods of Making the Same
CORNING INCORPORATED
0 cites - US120435752024Glass Laminate with Buried Stress Spikes to Arrest Cracks and Methods of Making the Same
CORNING INCORPORATED
0 cites - US120322162024Integrated Circuit Packages Having Electrical and Optical Connectivity and Methods of Making the Same
CORNING INCORPORATED
0 cites - US120350802024Image Sensing Device Using Interpolated Images to Generate Refined Images
SK Hynix Inc.
0 cites - US119233142024Semiconductor Package Including a Trench in a Passivation Layer
Samsung Electronics Co., Ltd.
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- US118872822024Noise Removing Circuit, Image Sensing Device and Operation Method of the Same
SK Hynix Inc.
0 cites - US118759932024Low Warp Fan-out Processing Method and Production of Substrates Therefor
CORNING INCORPORATED
0 cites - US118438682023Electronic Apparatus Based on Multiple Exposure Image and Operating Method Thereof
SK Hynix Inc.
0 cites - US117641172023Hermetically Sealed Optically Transparent Wafer-level Packages and Methods for Making the Same
CORNING INCORPORATED
0 cites - US117525002023Microfluidic Devices and Methods for Manufacturing Microfluidic Devices
CORNING INCORPORATED
0 cites - US116976172023Glass Laminate with Buried Stress Spikes to Arrest Cracks and Methods of Making the Same
CORNING INCORPORATED
0 cites - 0 cites
- US116642852023Electronic Packages Including Structured Glass Articles and Methods for Making the Same
CORNING INCORPORATED
0 cites - US116514762023Noise Removing Circuit, Image Sensing Device and Operation Method of the Same
SK Hynix Inc.
0 cites - 0 cites
- US115730782023Apparatus and Method for Determining Refractive Index, Central Tension, or Stress Profile
CORNING INCORPORATED
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