Patents/Inventors

Jin-neng Wu

TainanTW3 patents

4 Patents

US122150182025
Method for Manufacturing Package Structure
WINBOND ELECTRONICS Corp.
0 cites
US119703882024
Package Structure and Method for Manufacturing the Same
WINBOND ELECTRONICS Corp.
0 cites
US116581382023
Semiconductor Device Including Uneven Contact in Passivation Layer
Winbond Electronics Corp.
0 cites
US116108572023
Method of Manufacturing Circuit Structure
Winbond Electronics Corp.
0 cites